Francois Roy

发表

Basic technologies for high-performance solid-state image sensors for CIM applications

G. Boucharlat, B. Dimitriadis, Didier Herault, 1990 .

THX 31162: 768 x 576 pixel area array CCD sensor

Pierre Blanchard, Didier Herault, Francois Roy, 1990, Other Conferences.

Back-side-illuminated 1.4μm pixel with a vertically pinned photodiode based on hole collection, PMOS readout chain and active side-wall passivation

Guo-Neng Lu, Francois Roy, Bastien Mamdy, 2015, Applied Optics and Photonics China.

Inorganic color filters by MOCVD for CMOS imager and colorimetry

Francois Roy, Samir Guerroudj, Jean-Luc Deschanvres, 2008, SPIE Photonics Europe.

ep Trench Isolation for CMOS Image S

Francois Roy, Bastien Mamdy, Nayera Ahmed, 2014 .

Total Ionizing Dose Effects on CMOS Image Sensors with Deep-Trench Isolation

Guo-Neng Lu, Francois Roy, Nayera Ahmed, 2014 .

12.4 SXGA Pinned Photodiode CMOS Image Sensor in 0.35µm Technology

Robert Henderson, Francois Roy, Keith Findlater, 2003 .

New mechanism of plasma induced damage on CMOS image sensor: Analysis and process optimization

Francois Roy, C. Aumont, A. Tournier, 2010 .

Back Illuminated Vertically Pinned Photodiode with in Depth Charge Storage

Francois Roy, L. Pinzelli, Maxime Gatefait, 2011 .

P-type BSI Image Sensor with Active Deep Trench Interface Passivation for Radiation-hardened Imaging Systems

Guo-Neng Lu, Francois Roy, Bastien Mamdy, 2016 .

Mega-Pixel back-illuminated image sensor in 1 T 5 architecture with 1 . 45 μ m pixel pitch

Francois Roy, Pierre Gidon, Perceval Coudrain, 2007 .