Eckhard Langer

SEM-based nanoprobing on 32 and 28 nm CMOS devices challenges for semiconductor failure analysis

Holger Herzog, Christian Hobert, Erik Paul, 2014, Microelectron. Reliab..

Physical failure analysis in semiconductor industry—challenges of the copper interconnect process

Ehrenfried Zschech, Kornelia Dittmar, Eckhard Langer, 2002 .

Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation

Ehrenfried Zschech, Eckhard Langer, E. Zschech, 2004 .