William Sanfins

Preliminary failure-mode characterization of emerging direct-lead-bonding power module. Comparison with standard wire-bonding interconnection

Philippe Baudesson, Frédéric Richardeau, Damien Risaletto, 2015, Microelectron. Reliab..

Failure to short-circuit capability of emerging direct-lead-bonding power module. Comparison with standard interconnection. Application for dedicated fail-safe and fault-tolerant converters embedded in critical applications

Damien Risaletto, Frederic Richardeau, Gael Blondel, 2015, 2015 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe).