S. W. Liang

发表

Effect of bump size on current density and temperature distributions in flip-chip solder joints

Chih Chen, Wei-Chih Kuan, S. W. Liang, 2009, Microelectron. Reliab..

Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

King-Ning Tu, S. W. Liang, K. Tu, 2006 .

Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

S. W. Liang, Chih Chen, Y. Chang, 2006 .

Fabrication of Anodic Aluminum Oxide Film on Large-Area Glass Substrate

Jia-Min Shieh, Ching-Jung Yang, S. W. Liang, 2007 .

Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy

Da-Jeng Yao, Hsiang-Yao Hsiao, S. W. Liang, 2008 .

Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration

S. W. Liang, Chih Chen, Y. Chang, 2006 .

Relieving the current crowding effect in flip-chip solder joints during current stressing

King-Ning Tu, S. W. Liang, K. Tu, 2006 .

Electromigration issues in lead-free solder joints

S. W. Liang, Chih Chen, Chih Chen, 2006 .