C. H. Lee

System-of-Systems Enterprise CONOPS Assessment Decision Support Tools

Tien M. Nguyen, Thomas O. Freeze, C. H. Lee, 2020 .

Study of galvanized Sn-finished Ag surface

C. H. Lee, C. Y. Liu, C. Chiu, 2021, Journal of Materials Science: Materials in Electronics.

Effect of Chemical Additives in the Plating Bath on Surface Corrosion Resistance of Ni(P)

C. H. Lee, M. Cheng, C. Y. Liu, 2019, Journal of Electronic Materials.

Sulfidation Behavior of Inconel 738 Superalloy at 500–900°C

C. H. Lee, W. Kai, T. Lee, 2001 .

Effect of Basic Additives on Pt/Al2O3 for CO and Propylene Oxidation under Oxygen-Deficient Conditions

C. H. Lee, Y. W. Chen, 1997 .

Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration

C. H. Lee, C. Y. Chen, C. Y. Liu, 2021, Journal of Electronic Materials.

Microstructure and mechanical properties of Al 6061 joints diffusion brazed using Cu interlayer

C. H. Lee, K. Shin, D. Cho, 2002 .

Effect of eutectic reaction between depositing atoms and substrate elements on morphological evolution of Sn–Bi–Sn multilayer deposition

C. H. Lee, Chih‐Hao Lee, Chi-Jen Liu, 2020 .

Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface

C. H. Lee, Yugyung Lee, C. Y. Liu, 2022, Journal of Materials Science: Materials in Electronics.