Brian Roggeman

Joint Level Test Methods for Solder Pad Cratering Investigations

Venkatesh Arasanipalai Raghavan, Peter Borgesen, Brian Roggeman, 2011 .

Multi DOE Study on 28nm (RF) WLP Package to Investigate BLR Performance of Large WLP Die with 0.35mm Ball Pitch Array

Steven X. Xu, Ahmer Syed, Tong Cui, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Impact of board configuration and shock loading conditions for board level drop test

James Pitarresi, Brian Roggeman, Pradosh Guruprasad, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Duplicable and effective — A new drop test for BGA assemblies

Hossein Shirangi, Andy Zhang, Dongji Xie, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

On the Assessment of the Life of SnAgCu Solder Joints in Cycling With Varying Amplitudes

Peter Borgesen, Liang Yin, Brian Roggeman, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.