Jason P. Gill

Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes

Fen Chen, Daniel C. Edelstein, Ian D. Melville, 2005, SPIE Optics East.

Threshold electromigration failure time and its statistics for Cu interconnects

Emmanuel Yashchin, Baozhen Li, Ronald G. Filippi, 2006 .

Thermal conductance of IC interconnects embedded in dielectrics

Timothy D. Sullivan, Jason P. Gill, D. Harmon, 1998, 1998 IEEE International Integrated Reliability Workshop Final Report (Cat. No.98TH8363).