R. Conti

Magnetic fields from overhead power lines: advanced prediction techniques for environmental impact assessment and support to design

D. Andreuccetti, R. Rendina, A. Giorgi, 2003, 2003 IEEE Bologna Power Tech Conference Proceedings,.

STI Gap-Fill Technology with High Aspect Ratio Process for 45nm CMOS and beyond

A. Jain, A.T. Tilke, W. Wille, 2006, The 17th Annual SEMI/IEEE ASMC 2006 Conference.

Shallow Trench Isolation for the 45-nm CMOS Node and Geometry Dependence of STI Stress on CMOS Device Performance

K.-H. Bach, A. Jain, M. Eller, 2007, IEEE Transactions on Semiconductor Manufacturing.