Weng Hong Teh

发表

Investigation of near-room-temperature self-annealing of electrochemical-deposited (ECD) blanket copper films

P. D. Foo, Weng Hong Teh, L. T. Koh, 2000, Other Conferences.

Stealth dicing characterization, optimization, integration, and operations management for ultra-thin stacked memory dies

Weng Hong Teh, W. H. Teh, 2014 .

Green energy harvesting technology in 3D IC

Wei Wang, Weng Hong Teh, 2010, The 2010 International Conference on Green Circuits and Systems.

Integrating vertically aligned carbon nanotubes on micromechanical structures

Gehan A. J. Amaratunga, Weng Hong Teh, William I. Milne, 2003 .

Characteristics of a micromachined floating-gate high-electron-mobility transistor at 4.2K

Weng Hong Teh, Harvey E. Beere, D. A. Ritchie, 2005 .

Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation

Roy E. Welsch, Duane S. Boning, Weng Hong Teh, 2015, IEEE Transactions on Semiconductor Manufacturing.

Backside Infrared Interferometric Patterned Wafer Thickness Sensing for Through-Silicon-Via (TSV) Etch Metrology

Weng Hong Teh, D Marx, D Grant, 2010, IEEE Transactions on Semiconductor Manufacturing.

Cross-linked PMMA as a low-dimensional dielectric sacrificial layer

Weng Hong Teh, Chi-Te Liang, W. H. Teh, 2003 .

Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature

Weng Hong Teh, Joseph Xie, W. H. Teh, 2001 .

Near-zero curvature fabrication of miniaturized micromechanical Ni switches using electron beam cross-linked PMMA

Weng Hong Teh, Jikui Luo, A. Pavlov, 2003 .

SU-8 for real three-dimensional subdiffraction-limit two-photon microfabrication

Ute Drechsler, Weng Hong Teh, Rainer F. Mahrt, 2004 .