J. Reichl

Thermal component models for electro thermal analysis of multichip power modules

M. Velez-Reyes, J.J. Rodriguez, D. Berning, 2002, Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344).

High speed IGBT module transient thermal response measurements for model validation

C. Ellenwood, Jih-Sheng Lai, David W. Berning, 2003, 38th IAS Annual Meeting on Conference Record of the Industry Applications Conference, 2003..

Power balance control and voltage conditioning for fuel cell converter with multiple sources

Jih-Sheng Lai, J. Ferrell, T. Nergaard, 2002, 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289).

Six-pack IGBT dynamic electro-thermal model: parameter extraction and validation

J.-S. Lai, D. Berning, J. Reichl, 2004, Nineteenth Annual IEEE Applied Power Electronics Conference and Exposition, 2004. APEC '04..

Inverter Dynamic Electro-Thermal Modeling and Simulation with Experimental Verification

T. McNutt, J.-S. Lai, D. Berning, 2005, 2005 IEEE 36th Power Electronics Specialists Conference.

Development and Validation of a Small-Scale Anechoic Wind Tunnel

Con J. Doolan, Damien Leclercq, J. Reichl, 2007 .