R. Iannuzzelli

The reliability nomograph-a quick, easy-to-use graphical predictor of package/module interconnect reliability

R. Iannuzzelli, 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.

The reliability nomograph-graphical predictor of package/module interconnect reliability

R. Iannuzzelli, 1997 .

Predicting solder joint reliability, model validation

R. Iannuzzelli, 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).

Validation of module assembly physical models

R. Iannuzzelli, 1990, 40th Conference Proceedings on Electronic Components and Technology.

Predicting plated-through-hole reliability in high temperature manufacturing processes

R. Iannuzzelli, 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.