J. R. Morris

Stencil printing of solder paste for fine-pitch surface mount assembly

J. R. Morris, T. Wojcik, 1991 .

Flip-chip-on-board (FCOB) assembly and reliability

J. R. Morris, S. Yegnasubramanian, R. Deshmukh, 1997, Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium.

Scale effects in convoluted thermal/spatial statistics of plasticity initiation in small stressed volumes during nanoindentation

J. R. Morris, H. Bei, Tianlei Li, 2012 .

Designed experiment to assess flip-chip-on-board reliability

J. R. Morris, A. Serafino, S. Yegnasubramanian, 1998, Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205).

Molecular dynamics simulation of nanoscale machining of copper

J. R. Morris, Ashraf F. Bastawros, Rana Biswas, 2003 .