Sesha Varadarajan

Enabling Robust Copper Fill of High Aspect Ratio Through Silicon Vias

Mark J. Willey, Damo Srinivas, Sesha Varadarajan, 2010 .

Self-Aligned Barrier : Improves Interconnect Reliability

Sesha Varadarajan, Roey Shaviv, Kaushik Chattopadhyay, 2008 .

Copper electroplating approaches for 16nm technology

Sesha Varadarajan, Jonathan Reid, Andrew John Mckerrow, 2010 .