Rafael Reif

发表

BiMOS transistors: merged bipolar/sidewall MOS transistors

Rafael Reif, Hae-Seung Lee, 1989 .

Perspectives on laser processing technology for microelectronics

Rafael Reif, 1985 .

A Course on Plasma Processing in Integrated Circuit Fabrication.

Rafael Reif, Herbert H. Sawin, 1983 .

Technology and applications of three-dimensional integration

Nisha Checka, Chuan Seng Tan, Rafael Reif, 2004 .

Evaluation of C 4 F 8 O as an Alternative Plasma‐Enhanced Chemical Vapor Deposition Chamber Clean Chemistry

Rafael Reif, Simon Karecki, R. Reif, 2000 .

Microelectronics Thin Film Handling and Transfer Using Low-Temperature Wafer Bonding

Chuan Seng Tan, Rafael Reif, 2005 .

Evaluation of Pentafluoroethane and 1,1-Difluoroethane for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool

Rafael Reif, Ritwik Chatterjee, Laurie Beu, 2000 .

3-D Interconnects Using Cu Wafer Bonding : Technology and Applications

Nisha Checka, Chuan Seng Tan, Rafael Reif, 2004 .

Characteristics of narrow-channel polysilicon thin-film transistors

Noriyoshi Yamauchi, K. Tanaka, Rafael Reif, 1991 .

Process development and bonding quality investigations of silicon layer stacking based on copper wafer bonding

Chuan Seng Tan, Rafael Reif, Kuan-Neng Chen, 2005 .

Recrystallization of amorphized polycrystalline silicon films on SiO2: Temperature dependence of the crystallization parameters

R. B. Iverson, Rafael Reif, R. Reif, 1987 .

Observation of interfacial void formation in bonded copper layers

Chuan Seng Tan, Rafael Reif, S. Pozder, 2005 .

Low‐Temperature Deposition of Highly Textured Aluminum Nitride by Direct Current Magnetron Sputtering for Applications in Thin‐Film Resonators

Charles G. Sodini, Rafael Reif, C. Sodini, 1999 .

Silicon epitaxy at 650–800 °C using low‐pressure chemical vapor deposition both with and without plasma enhancement

Rafael Reif, R. Reif, T. J. Donahue, 1985 .

Air‐bridge microcavities

Shanhui Fan, Rafael Reif, Leslie A. Kolodziejski, 1995 .

Analytical modeling of polycrystalline silicon emitter bipolar transistors under high-level injection

Chun-Yen Chang, Rafael Reif, S. M. Sze, 1994 .

Effects of Ge on Material and Electrical Properties of Polycrystalline Si1 − x Ge x for Thin‐Film Transistors

Rafael Reif, Takashi Noguchi, R. Reif, 1995 .

Silicon Layer Stacking Enabled by Wafer Bonding

Chuan Seng Tan, Rafael Reif, Kuan-Neng Chen, 2006 .

Polycrystalline silicon thin films processed with silicon ion implantation and subsequent solid-phase crystallization: Theory, experiments, and thin-film transistor applications

Noriyoshi Yamauchi, Rafael Reif, R. Reif, 1994 .

Use of 2H-heptafluoropropane, 1-iodoheptafluoropropane, and 2-iodoheptafluoropropane for a high aspect ratio via etch in a high density plasma etch tool

Rafael Reif, Laurie Beu, Simon Karecki, 1998 .

Metrology of sub-0.5 μm silicon epitaxial films

Rafael Reif, R. Reif, Weize Chen, 1998 .

Silicon Multilayer Stacking Based on Copper Wafer Bonding

Chuan Seng Tan, Rafael Reif, C. S. Tan, 2005 .

Silicon selective epitaxial growth at 800 °C using SiH4/H2 assisted by H2/Ar plasma sputter

Rafael Reif, R. Reif, T. Yew, 1989 .

A BiCMOS process utilizing selective epitaxy for analog/digital applications

Rafael Reif, Hyung-Seok Lee, 1989 .

Polysilicon thin-film transistors with channel length and width comparable to or smaller than the grain size of the thin film

Noriyoshi Yamauchi, Rafael Reif, R. Reif, 1991 .

Use of Novel Hydrofluorocarbon and Iodofluorocarbon Chemistries for a High Aspect Ratio Via Etch in a High Density Plasma Etch Tool

Rafael Reif, Laurie Beu, Simon Karecki, 1998 .

Copper Metallization Needs for Wafer-Level, Three-Dimensional Integration

Jian-Qiang Lu, Rafael Reif, Kuan-Neng Chen, 2006 .

Investigations of strength of copper-bonded wafers with several quantitative and qualitative tests

Rafael Reif, Kuan-Neng Chen, S. M. Chang, 2006 .

Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration

Chuan Seng Tan, Rafael Reif, Kuan-Neng Chen, 2005 .

Abnormal contact resistance reduction of bonded copper interconnects in three-dimensional integration during current stressing

Chuan Seng Tan, Rafael Reif, Kuan-Neng Chen, 2005 .

Evaluation of trifluoroacetic anhydride as an alternative plasma enhanced chemical vapor deposition chamber clean chemistry

Rafael Reif, Simon Karecki, Laura Pruette, 1998 .