T. C. Chai

Impact of Packaging Design on Reliability of Large Die Cu/Low-$\kappa$ (BD) Interconnect

T. C. Chai, X. Zhang, H. Y. Li, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Structure Design Optimization and Reliability Analysis on a Pyramidal-Shape Three-Die-Stacked Package With Through-Silicon Via

Xiaowu Zhang, T. C. Chai, F. X. Che, 2012, IEEE Transactions on Device and Materials Reliability.