Siao Li Liew

Impact of Packaging Design on Reliability of Large Die Cu/Low-$\kappa$ (BD) Interconnect

T. C. Chai, X. Zhang, H. Y. Li, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Texture of NiGe on Ge(001) and its evolution with formation temperature

Siao Li Liew, Bavani Balakrisnan, C. C. Tan, 2005 .