Janne J. Sundelin

The influence of multiple reflow cycles on solder joint voids for lead‐free PBGAs

Eero Ristolainen, Sami T. Nurmi, Janne J. Sundelin, 2003 .

Recrystallization behaviour of SnAgCu solder joints

Janne J. Sundelin, Toivo Lepistö, T. Lepistö, 2008 .

Mechanical and microstructural properties of SnAgCu solder joints

Eero Ristolainen, Toivo Lepistö, Janne J. Sundelin, 2006 .

The effect of PCB surface finish on lead‐free solder joints

Eero Ristolainen, Toivo Lepistö, Janne J. Sundelin, 2005 .

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

Dongkai Shangguan, Eero Ristolainen, Dongji Xie, 2004 .