M. T. Bulsara

High Performance Mixed Signal Circuits Enabled by the Direct Monolithic Heterogeneous Integration of InP HBT and Si CMOS on a Silicon Substrate

E. Guiot, T. E. Kazior, J. M. Fastenau, 2010, 2010 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

Thermal considerations for advanced SOI substrates designed for III-V/Si heterointegration

E. Augendre, M. Urteaga, B. Brar, 2009, 2009 IEEE International SOI Conference.

Progress and challenges in the direct monolithic integration of III–V devices and Si CMOS on silicon substrates

E. Augendre, J. M. Fastenau, M. Urteaga, 2009, 2009 IEEE International Conference on Indium Phosphide & Related Materials.

Preparation of novel SiGe-free strained Si on insulator substrates

G. Braithwaite, E. A. Fitzgerald, R. Hammond, 2002, 2002 IEEE International SOI Conference.

A high performance differential amplifier through the direct monolithic integration of InP HBTs and Si CMOS on silicon substrates

E. Augendre, J. M. Fastenau, M. Urteaga, 2009, 2009 IEEE MTT-S International Microwave Symposium Digest.