Paul Philippe

Method collective of packaging a plurality of components forms initially in a same substrate

Pierre Gidon, Paul Philippe, 1998 .

Direct and Polymer Bonding of III-V to Processed Silicon-On-Insulator for Hybrid Silicon Evanescent Lasers Fabrication

Emmanuel Augendre, Maxime Argoud, Julie Harduin, 2010 .

Dry-film technology as a standard process for passive optical alignment of Silicon Photonics Devices

Paul Philippe, Stephane Bernabe, Christophe Kopp, 2009, 2009 59th Electronic Components and Technology Conference.