K. W. Ip

Fuzzy regression approach to modelling transfer moulding for microchip encapsulation

K. W. Ip, C. K. Kwong, Y. W. Wong, 2003 .

Optimization of process conditions for the transfer molding of electronic packages

K. W. Ip, C. K. Kwong, K. W Tong, 2003 .

Bearing capacity for foundation near slope

K. W. Ip, Kai Wing Ip, 2005 .