文
论文分享
演练场
杂货铺
论文推荐
字
编辑器下载
登录
注册
Thomas Malzer
发表
SKiN: Double side sintering technology for new packages
Thomas Stockmeier, Peter Beckedahl, Christian Gobl, 2011, 2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs.