Chia-Wen Fan

Assembly and reliability assessment of 50µm-thick chip stacking by wafer-level underfill film

Kuo-Shu Kao, Ren-Shin Cheng, Tsung-Fu Yang, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

John H. Lau, Chau-Jie Zhan, Shin-Yi Huang, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Kuo-Shu Kao, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Ren-Shin Cheng, Tai-Hong Chen, John H. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding

Kuo-Shu Kao, Yin-Po Hung, Ren-Shin Cheng, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

A novel 3D IC assembly process for ultra-thin chip stacking

Ren-Shin Cheng, Chau-Jie Zhan, Cheng-Ta Ko, 2014, 2014 International Conference on Electronics Packaging (ICEP).