Lay Wai Kong

Known void size micro-bump, a novel standard of 3D X-ray computed tomography in-line metrology for accuracy assessment and monitoring

Lay Wai Kong, Osborne A. Martin, L. Kong, 2018, 2018 IEEE International Instrumentation and Measurement Technology Conference (I2MTC).

Performance optimization in scale-out storage using design of experiment as heuristic

Lay Wai Kong, 2017, 2017 IEEE International Conference on Big Data (Big Data).

Thermally induced void growth in through-silicon vias

Lay Wai Kong, Andrew C. Rudack, Alain C. Diebold, 2013 .

Characterization and Prediction of Performance Loss and MTTR During Fault Recovery On Scale-out Storage Using DOE & RSM: A Case Study with Ceph

Lay Wai Kong, Orlando moreno, 2018 .

Infrared microscopy for overlay and defect metrology on 3D-interconnect bonded wafers

Lay Wai Kong, Andrew C. Rudack, L. Kong, 2010, 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

Investigation of optical properties of benzocyclobutene wafer bonding layer used for 3D interconnects via infrared spectroscopic ellipsometry

Lay Wai Kong, Alain C. Diebold, Pratibha Singh, 2011 .