H. S. Hsu
发表
Innovative fan-out wafer level package using lamination process and adhered Si wafer on the backside
H. S. Hsu,
D. Chang,
K. Liu,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Steve Chiu,
Kenny Liu,
Chun-Tang Lin,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).