Jeffrey C. Suhling

发表

First and Second Order Piezoresistive Characteristics of CMOS FETs: Weak through Strong Inversion

Richard C. Jaeger, Jeffrey C. Suhling, 2018, 2018 48th European Solid-State Device Research Conference (ESSDERC).

Reliability and Life Study of Hydraulic Solenoid Valve - Part 1 - A Multi-physics Finite Element Model

Song-Yul Choe, Jeffrey C. Suhling, George T. Flowers, 2009 .

Reliability of a CBGA miroproessor package incorpoating a decoupling capacitor array

Pradeep Lall, Chandan Bhat, Richard C. Jaeger, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging

Pradeep Lall, Jeffrey C. Suhling, Muhannad Mustafa, 2016, Microelectron. Reliab..

Current dependence of the piezoresistive coefficients of CMOS FETs on (100) silicon

Richard C. Jaeger, Jeffrey C. Suhling, Safina Hussain, 2014, 2014 44th European Solid State Device Research Conference (ESSDERC).

A 1D numerical model for rapid stress analysis in bipolar junction transistors

Michael C. Hamilton, Bogdan M. Wilamowski, Jeffrey C. Suhling, 2016 .

Special Section on InterPACK 2015

Ashish Gupta, Toru Ikeda, Jeffrey C. Suhling, 2016 .

Error analysis for piezoresistive stress sensors used in flip chip packaging

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between −180°C and 80°C

Michael C. Hamilton, Jeffrey C. Suhling, Richard C. Jaeger, 2014 .

Improved finite element modeling strategies with multipoint constraints for BGA packages subjected to thermal cycling

Pradeep Lall, Jeffrey C. Suhling, Chienchih Chen, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Feature extraction and damage-precursors for prognostication of lead-free electronics

Jay Lee, Pradeep Lall, Madhura Hande, 2006, 56th Electronic Components and Technology Conference 2006.

Improved Submodeling Finite Element Simulation Strategies for BGA Packages Subjected to Thermal Cycling

Pradeep Lall, Jeffrey C. Suhling, Chienchih Chen, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Effects of aging on SAC-Bi solder materials

Pradeep Lall, Jeffrey C. Suhling, Munshi Basit, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

The effects of SAC alloy composition on aging resistance and reliability

Pradeep Lall, Jeffrey C. Suhling, Michael J. Bozack, 2009, 2009 59th Electronic Components and Technology Conference.

Piezoresistive characteristics of short-channel MOSFETs on (100) silicon

Richard C. Jaeger, Jeffrey C. Suhling, R. Jaeger, 2001 .

Reduction of lead free solder aging effects using doped SAC alloys

Pradeep Lall, R. Wayne Johnson, Jeffrey C. Suhling, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

Jeffrey C. Suhling, John L. Evans, Zhou Hai, 2017, Materials.

Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging

Pradeep Lall, Jeffrey C. Suhling, Mohammad Motalab, 2015 .

Thermal cycling reliability of aged PBGA assemblies - comparison of Weibull failure data and finite element model predictions

Pradeep Lall, Jeffrey C. Suhling, John L. Evans, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, Jeffrey C. Suhling, 2007 .

Effects of aging on shear cyclic stress strain and fatigue behaviors of lead free solder joints

Pradeep Lall, Jeffrey C. Suhling, Jordan C. Roberts, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants

Pradeep Lall, Jeffrey C. Suhling, Nusrat J. Chhanda, 2011 .

Evaluation of piezoresistive coefficient variation in silicon stress sensors using a four-point bending test fixture

Richard C. Jaeger, Jeffrey C. Suhling, R. E. Beaty, 1992 .

Thermal cycling reliability of lead‐free chip resistor solder joints

Pradeep Lall, R. Wayne Johnson, Jeffrey C. Suhling, 2004 .

Evaluation of Die Stress Using van der Pauw Sensors

Bogdan M. Wilamowski, Richard C. Jaeger, Jeffrey C. Suhling, 1997 .

The effects of silver content and solidification profile on the Anand constitutive model for SAC lead free solders

Pradeep Lall, Jeffrey C. Suhling, Jordan C. Roberts, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages

Jeffrey C. Suhling, John L. Evans, Zhou Hai, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Reliability and life study of hydraulic solenoid valve. Part 1: A multi-physics finite element model

Song-Yul Choe, George T. Flowers, Jeffrey C. Suhling, 2009 .

The effects of aging on the fatigue life of lead free solders

Pradeep Lall, Jeffrey C. Suhling, Jordan C. Roberts, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging

Pradeep Lall, Jeffrey C. Suhling, Nusrat J. Chhanda, 2013 .

DIC Based Investigation Into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint

Pradeep Lall, Jeffrey C. Suhling, Kazi Mirza, 2015 .

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

Richard C. Jaeger, Jeffrey C. Suhling, R. E. Beaty, 1991 .

Nano-Underfills for High-Reliability Applications in Extreme Environments

Pradeep Lall, Jeffrey C. Suhling, Guoyun Tian, 2005, ECTC 2005.

High temperature die-attach effects on die stresses

Richard C. Jaeger, Jeffrey C. Suhling, Richard R. Grzybowski, 1998, 1998 Fourth International High Temperature Electronics Conference. HITEC (Cat. No.98EX145).

Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments

Pradeep Lall, Jeffrey C. Suhling, P. Choudhary, 2005 .

Design and Calibration of Optimized (111) Silicon Stress Sensing Test Chips

Bogdan M. Wilamowski, Richard C. Jaeger, Jeffrey C. Suhling, 1997 .

Characterization of microprocessor chip stress distributions during component packaging and thermal cycling

Pradeep Lall, Richard C. Jaeger, Jeffrey C. Suhling, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Correlation of reliability models including aging effects with thermal cycling reliability data

Pradeep Lall, Jeffrey C. Suhling, John L. Evans, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Characterization of aging effects in lead free solder joints using nanoindentation

Pradeep Lall, Jeffrey C. Suhling, Barton C. Prorok, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Die surface stress variation during thermal cycling and thermal aging reliability tests

Richard C. Jaeger, Jeffrey C. Suhling, Richard R. Grzybowski, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).