Kin Leong Pey

发表

Spectroscopy of SILC trap locations and spatial correlation study of percolation path in the high-κ and interfacial layer

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2015, 2015 IEEE International Reliability Physics Symposium.

Percolation Framework and Monte Carlo Techniques for Improved Probabilistic Design of Variability in Products and Systems

Nagarajan Raghavan, Kin Leong Pey, K. Pey, 2017 .

Design for reliability through engineering optimization

Chuan Seng Tan, Kin Leong Pey, Wee Loon Ng, 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).

Understanding spatial resolution of laser voltage imaging

Kin Leong Pey, V. K. Ravikumar, G. Lim, 2018, Microelectron. Reliab..

Compliance current dominates evolution of NiSi2 defect size in Ni/dielectric/Si RRAM devices

Xing Wu, Nagarajan Raghavan, Michel Bosman, 2016, Microelectron. Reliab..

Conductive filament formation at grain boundary locations in polycrystalline HfO2 -based MIM stacks: Computational and physical insight

Nagarajan Raghavan, Alok Ranjan, Michel Bosman, 2016, Microelectron. Reliab..

Impact of local structural and electrical properties of grain boundaries in polycrystalline HfO2 on reliability of SiOx interfacial layer

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2014, Microelectron. Reliab..

The variation of the leakage current characteristics of W/Ta2O5/W MIM capacitors with the thickness of the bottom W electrode

Shurong Dong, W. S. Lau, Hei Wong, 2016, Microelectron. Reliab..

Dielectric Breakdown in 2D Layered Hexagonal Boron Nitride — The Knowns and the Unknowns

Nagarajan Raghavan, Kin Leong Pey, Kalya Shubhakar, 2019, 2019 IEEE International Reliability Physics Symposium (IRPS).

Area and pulsewidth dependence of bipolar TDDB in MgO magnetic tunnel junction

Nagarajan Raghavan, Kin Leong Pey, J. H. Lim, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Variability model for forming process in oxygen vacancy modulated high-κ based resistive switching memory devices

Daniel D. Frey, Nagarajan Raghavan, Michel Bosman, 2014, Microelectron. Reliab..

Monte Carlo model of reset stochastics and failure rate estimation of read disturb mechanism in HfOx RRAM

Daniel D. Frey, Nagarajan Raghavan, Michel Bosman, 2015, 2015 IEEE International Reliability Physics Symposium.

Preliminary study of integrated physics and mathematics bridging course

U-Xuan Tan, Kin Leong Pey, Chee Huei Lee, 2017, 2017 IEEE Global Engineering Education Conference (EDUCON).

Effects of thermal annealing on the charge localization characteristics of HfO2/Au/HfO2 stack

Shurong Dong, W. S. Lau, Hei Wong, 2016, Microelectron. Reliab..

Assessment of read disturb immunity in conducting bridge memory devices - A thermodynamic perspective

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2014, Microelectron. Reliab..

Structure of the oxide damage under progressive breakdown

Salvatore Lombardo, Kin Leong Pey, C. H. Tung, 2005, Microelectron. Reliab..

Probabilistic insight to possibility of new metal filament nucleation during repeated cycling of conducting bridge memory

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2015, Microelectron. Reliab..

An SEM/STM based nanoprobing and TEM study of breakdown locations in HfO2/SiOx dielectric stacks for failure analysis

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2015, Microelectron. Reliab..

Spatio-Temporal Defect Generation Process in Irradiated HfO2 MOS Stacks: Correlated Versus Uncorrelated Mechanisms

Nagarajan Raghavan, Kin Leong Pey, Andrea Padovani, 2019, 2019 IEEE International Reliability Physics Symposium (IRPS).

Mechanism of soft and hard breakdown in hexagonal boron nitride 2D dielectrics

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Statistics of retention failure in the low resistance state for hafnium oxide RRAM using a Kinetic Monte Carlo approach

Daniel D. Frey, Nagarajan Raghavan, Michel Bosman, 2015, Microelectron. Reliab..

Correlation of failure mechanism of constant-current-stress and constant-voltage-stress breakdowns in ultrathin gate oxides of nMOSFETs by TEM

Kin Leong Pey, Y. Sun, C. H. Tung, 2003, Microelectron. Reliab..

High-κ dielectric breakdown in nanoscale logic devices - Scientific insight and technology impact

Nagarajan Raghavan, Kin Leong Pey, Kalya Shubhakar, 2014, Microelectron. Reliab..

Analysis of quantum conductance, read disturb and switching statistics in HfO2 RRAM using conductive AFM

Nagarajan Raghavan, Alok Ranjan, Kin Leong Pey, 2016, Microelectron. Reliab..

Physical analysis of hard and soft breakdown failures in ultrathin gate oxides

Kin Leong Pey, C. H. Tung, M. K. Radhakrishnan, 2002, Microelectron. Reliab..

Robust Electromigration reliability through engineering optimization

Chuan Seng Tan, Kin Leong Pey, Oliver Aubel, 2014, Microelectron. Reliab..

Prognostic methodology for remaining useful life estimation of retention loss in nanoscale resistive switching memory

Daniel D. Frey, Nagarajan Raghavan, Kin Leong Pey, 2014, Microelectron. Reliab..

Statistical nature of hard breakdown recovery in high-κ dielectric stacks studied using ramped voltage stress

Shurong Dong, Nagarajan Raghavan, Hei Wong, 2018, Microelectron. Reliab..

Crowdfunding Campaign As a Design-Based Pedagogical Approach for Experiential Learning of Technology Entrepreneurship

Jianxi Luo, Kin Leong Pey, Kristin Wood, 2018, Volume 3: 20th International Conference on Advanced Vehicle Technologies; 15th International Conference on Design Education.

The radial distribution of defects in a percolation path

Kin Leong Pey, Chih-Hang Tung, K. Pey, 2008 .

Study of preferential localized degradation and breakdown of HfO2/SiOx dielectric stacks at grain boundary sites of polycrystalline HfO2 dielectrics

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2013 .

Impact of Gate Dielectric Breakdown Induced Microstructural Defects on Transistor Reliability

Kin Leong Pey, Lei Jun Tang, Xiang Li, 2009 .

Nanoscale Characterization of HfO 2 /SiO x Gate Stack Degradation by Scanning Tunneling Microscopy

Kin Leong Pey, G. Bersuker, D. S. Ang, 2009 .

Oxygen-Soluble Gate Electrodes for Prolonged High-$ \kappa$ Gate-Stack Reliability

Xing Wu, Nagarajan Raghavan, Michel Bosman, 2011, IEEE Electron Device Letters.

Optoelectronic material analysis and device failure analysis using SEM cathodoluminescence

J.C.H. Phang, Kin Leong Pey, Wai Kin Chim, 1994 .

The nature of dielectric breakdown

Kin Leong Pey, Chih-Hang Tung, K. Pey, 2008 .

Size difference in dielectric-breakdown-induced epitaxy in narrow n- and p-metal oxide semiconductor field effect transistors

Kin Leong Pey, Chih-Hang Tung, W. H. Lin, 2003 .

Physical analysis of Ti-migration in 33 /spl Aring/ gate oxide breakdown

Kin Leong Pey, Chih-Hang Tung, W. H. Lin, 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).

Two-dimensional analytical Mott-Gurney law for a trap-filled solid

Kin Leong Pey, Lay Kee Ang, K. Pey, 2007 .

A study of thermo-mechanical stress and its impact on through-silicon vias

Kin Leong Pey, N. Balasubramanian, N. Balasubramanian, 2008 .

Stability and composition of Ni–germanosilicided Si1−xGex films

Dimitri A. Antoniadis, Kin Leong Pey, Eugene A. Fitzgerald, 2004 .

Semiconductor parameters extraction using cathodoluminescence in the scanning electron microscope

Kin Leong Pey, K. Pey, D. Chan, 1993 .

Experimental characterization and modeling of the contact resistance of Cu–Cu bonded interconnects

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2009 .

Bilayer gate dielectric study by scanning tunneling microscopy

Hiroshi Iwai, Cedric Troadec, Kuniyuki Kakushima, 2007 .

Identifying the First Layer to Fail in Dual-Layer ${\rm SiO}_{\rm x}/{\rm HfSiON}$ Gate Dielectric Stacks

Nagarajan Raghavan, Kin Leong Pey, Andrea Padovani, 2013, IEEE Electron Device Letters.

Grain boundary assisted degradation and breakdown study in cerium oxide gate dielectric using scanning tunneling microscopy

Hiroshi Iwai, Nagarajan Raghavan, Kuniyuki Kakushima, 2011 .

Monte Carlo evidence for need of improved percolation model for non-weibullian degradation in high-κ dielectrics

Kin Leong Pey, N. Raghavan, K. Shubhakar, 2013, 2013 Proceedings Annual Reliability and Maintainability Symposium (RAMS).

Electrical characterization of platinum and palladium effects in nickel monosilicide/n-Si Schottky contacts

Kin Leong Pey, D. A. Antoniadis, Eugene A. Fitzgerald, 2006 .

Low-frequency noise measurement of copper damascene interconnects

L. T. Koh, Kin Leong Pey, W. K. Chim, 2000, Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).

Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2004 .

Unipolar recovery of dielectric breakdown in fully silicided high-κ gate stack devices and its reliability implications

Nagarajan Raghavan, Kin Leong Pey, X. Wu, 2010 .

Electrode material dependent breakdown and recovery in advanced high-κ gate stacks

Nagarajan Raghavan, Kin Leong Pey, Gang Zhang, 2010 .

Direct visualization and in-depth physical study of metal filament formation in percolated high-κ dielectrics

Michel Bosman, Kin Leong Pey, Thomas Kauerauf, 2010 .

Filamentation Mechanism of Resistive Switching in Fully Silicided High- $\kappa$ Gate Stacks

Xing Wu, Kin Leong Pey, Xing Wu, 2011, IEEE Electron Device Letters.

Feasibility of SILC Recovery in Sub-10-Å EOT Advanced Metal Gate–High-$\kappa$ Stacks

Xing Wu, Nagarajan Raghavan, Michel Bosman, 2013, IEEE Electron Device Letters.

Breakdowns in high-k gate stacks of nano-scale CMOS devices

Kin Leong Pey, Diing Shenp Ang, Chih-Hang Tung, 2005 .

Evidence for compliance controlled oxygen vacancy and metal filament based resistive switching mechanisms in RRAM

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2011 .

Dielectric breakdown — Recovery in logic and resistive switching in memory — Bridging the gap between the two phenomena

Xing Wu, Kin Leong Pey, N. Raghavan, 2012, 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology.

Length Effects on the Reliability of Dual-Damascene Cu Interconnects

Chee Lip Gan, Stefan P. Hau-Riege, Kin Leong Pey, 2002 .

Stochastic failure model for endurance degradation in vacancy modulated HfOx RRAM using the percolation cell framework

Daniel D. Frey, Nagarajan Raghavan, Michel Bosman, 2014, 2014 IEEE International Reliability Physics Symposium.

Electromigration resistance in a short three-contact interconnect tree

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2006 .

The effect of stress migration on electromigration in dual damascene copper interconnects

Chee Lip Gan, Nagarajan Raghavan, Kin Leong Pey, 2011 .

Detection of high-κ and interfacial layer breakdown using the tunneling mechanism in a dual layer dielectric stack

Nagarajan Raghavan, Kin Leong Pey, K. Pey, 2009 .

Leakage current and structural analysis of annealed HfO2/La2O3 and CeO2/La2O3 dielectric stacks: A nanoscopic study

Hiroshi Iwai, Kuniyuki Kakushima, Michel Bosman, 2014 .

Thermal stability of TiN metal gate prepared by atomic layer deposition or physical vapor deposition on HfO2 high-K dielectric

Kin Leong Pey, Hun-Jan Tao, Da-Yuan Lee, 2010 .

Role of oxygen vacancies in HfO2-based gate stack breakdown

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2010 .

Micro-tags for art: covert visible and infrared images using gap plasmons in native aluminum oxide

Kin Leong Pey, Hailong Liu, Ravikumar Venkat Krishnan, 2019, Optical Materials Express.

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2011 .

Evolution of Filament Formation in Ni/HfO2/SiOx/Si‐Based RRAM Devices

Xing Wu, Nagarajan Raghavan, Michel Bosman, 2015 .

The physical origin of random telegraph noise after dielectric breakdown

Kin Leong Pey, Chih-Hang Tung, Xiang Li, 2009 .

Interfacial reactions of Ni on Si1−xGex (x=0.2, 0.3) at low temperature by rapid thermal annealing

Dimitri A. Antoniadis, Kin Leong Pey, Eugene A. Fitzgerald, 2002 .

Carbon nanotube membranes with ultrahigh specific adsorption capacity for water desalination and purification

Kin Leong Pey, Rohit Karnik, Siu Fung Yu, 2013, Nature Communications.

The development of a tapered silicon micro-micromachining process for 3D microsystems packaging

Kin Leong Pey, N. Balasubramanian, N. Balasubramanian, 2008 .

Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2001 .

Resilience of ultra-thin oxynitride films to percolative wear-out and reliability implications for high-κ stacks at low voltage stress

Xing Wu, Nagarajan Raghavan, Michel Bosman, 2013 .

Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2003 .

Resistive switching in NiSi gate metal-oxide-semiconductor transistors

Nagarajan Raghavan, Michel Bosman, Kin Leong Pey, 2010 .

Percolation path and dielectric-breakdown-induced-epitaxy evolution during ultrathin gate dielectric breakdown transient

Salvatore Lombardo, Kin Leong Pey, Felix Palumbo, 2003 .

Joule heating-assisted electromigration failure mechanisms for dual damascene Cu/SiO/sub 2/ interconnects

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2003, Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003.

Intrinsic nanofilamentation in resistive switching

Xing Wu, Nagarajan Raghavan, Michel Bosman, 2013 .

A Compact Model for Undoped Silicon-Nanowire MOSFETs With Schottky-Barrier Source/Drain

Xing Zhou, Kin Leong Pey, Lay Kee Ang, 2009, IEEE Transactions on Electron Devices.

Chemical insight into origin of forming-free resistive random-access memory devices

Guo-Qiang Lo, Nagarajan Raghavan, Michel Bosman, 2011 .

Application of contact theory to metal-metal bonding of silicon wafers

Chee Lip Gan, Kin Leong Pey, Carl V. Thompson, 2007 .