N. Teneketges

Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects

Hsien-Yang Yeh, J. Cepeda-Rizo, N. Teneketges, 2005 .

Multichip Packaging Design for VLSI-Based Systems

N. Teneketges, C. Bartlett, J. Segelken, 1987 .