Young-Ho Kim

发表

A New Perfobond Shear Connector for Composite Action

Heung-Su Lee, Chul-Hun Chung, Jong-Myen Park, 2004 .

A new COP bonding using non-conductive adhesives for LCDs driver IC packaging

Young-Ho Kim, Zhi Gang Chen, 2006, Displays.

Interface analysis of embedded chip resistor device package and its effect on drop shock reliability.

Se-Hoon Park, Young-Ho Kim, Young-Ho Kim, 2012, Journal of nanoscience and nanotechnology.

Contact Resistance of the Chip-on-Glass Bonded 48Sn–52In Solder Joint

Jae-Hoon Choi, Tae-Sung Oh, Young-Ho Kim, 2005 .

Resistance switching properties of In2O3 nanocrystals memory device with organic and inorganic hybrid structure

Dong Uk Lee, Eun Kyu Kim, Young-Ho Kim, 2011 .

Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA)

Young-Ho Kim, Young-Ho Kim, Sun-Chul Kim, 2013 .

Chip to chip bonding using micro-cu bumps with sn capping layers

Min Suk Suh, Young-Ho Kim, Jin Soo Lee, 2009, 2009 European Microelectronics and Packaging Conference.

Low Temperature and Ultra Fine Pitch Joints Using Non-Conductive Adhesive for Flip Chip Technology

Tae-Sung Oh, Young-Ho Kim, Soo Yeol Kim, 2006, 2006 7th International Conference on Electronic Packaging Technology.

Intermetallic formation in the Sn-Ag solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength

Young-Ho Kim, Young-Ho Kim, Mu-Seob Shin, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

Resistive-switching memory effect of hybrid structures with polyimide and SnO2 nanocrystals.

Dong Uk Lee, Eun Kyu Kim, Hyunsik Im, 2012, Journal of nanoscience and nanotechnology.

Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

Young-Ho Kim, Sungtae Kim, Sungtae Kim, 2010 .

Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package

Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, 2010 .

Adhesion improvement of electroless plated Ni layer by ultrasonic agitation during zincating process

Young-Ho Kim, Young-Ho Kim, Jeong-Gi Jin, 2004 .

The effect of low dielectric polymer thickness on the electromigration characteristics of Al(1% Cu–0.5% Si) thin films

Sehoon Yoo, Yong-Chae Chung, Young-Ho Kim, 2001 .

Effect of surface roughness on the adhesion properties of Cu/Cr films on polyimide substrate treated by inductively coupled oxygen plasma

Nae-Eung Lee, Young-Ho Kim, N. Lee, 2005 .

Effect of permanganate treatment on through mold vias for an embedded wafer level package

Ji-Yeon Park, Se-Hoon Park, Young-Ho Kim, 2013, Electronic Materials Letters.

Contact resistance and shear strength of the solder joints formed using Cu bumps capped with Sn or Ag/Sn layer

Young-Ho Kim, Seunghyun Lee, Young-Ho Kim, 2005 .

A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging

Kyoung-Moo Harr, Sung Yi, Young-Ho Kim, 2009, 2009 59th Electronic Components and Technology Conference.

Non-Conductive Adhesive (NCA) Trapping Study in Chip on Glass Joints Fabricated Using Sn Bumps and NCA

Byeung-Gee Kim, Young-Ho Kim, Sang-Mok Lee, 2008 .

Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn−4.0Ag−0.5Cu and Cu−Zn Substrate

Young-Ho Kim, Young-Ho Kim, Young-Min Kim, 2010 .

A new Ni-Zn under bump metallurgy for Pb-free solder bump flip chip application

Young Min Kim, Jin-Young Park, Young-Ho Kim, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

A study on the nucleation behavior of zinc particles on aluminum substrate [flip-chip technology]

Jae-Ho Lee, Young-Ho Kim, Jae-Ho Lee, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

Adhesion and interface investigation of polyimide on metals

C. Feger, S. P. Kowalczyk, Young-Ho Kim, 1988 .

Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications

Young-Ho Kim, Sung Chul Kim, Hwan-Pil Park, 2017, Journal of Electronic Materials.

Chip-On-Glass Bonding Using Sn Bump and Non-Conductive Adhesive for LCD Application

Young-Ho Kim, Zhi Gang Chen, Bae-Yong Kim, 2006 .

The Reliability of 30 μm pitch COG joints fabricated using Sn/Cu bumps and non-conductive adhesive

Byeung-Gee Kim, Young-Ho Kim, Sang-Mok Lee, 2007, 2007 International Conference on Electronic Materials and Packaging.

The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn–3.5Ag solders on Cu substrates in fluxless soldering

Sung Woo Ma, Young-Ho Kim, Nam-Seog Kim, 2013, Journal of Materials Science: Materials in Electronics.

Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints

Sehoon Yoo, Young-Ho Kim, Young-Ho Kim, 2017, Journal of Electronic Materials.

Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum

Young-Ho Kim, Young-Ho Kim, Tae Hyun Kim, 2004 .

Interfacial reactions between Sn–3.0Ag–0.5Cu solder and Cu–xZn (x = 0–35 wt%) or Cu–xZn–yNi (x = 20 and 25 wt%, y = 15 and 10 wt%) substrates

Min Young Choi, Young-Ho Kim, Young-Ho Kim, 2013 .