Kyung-Woon Jang

Effect of shield-can for drop/shock behavior of board level assembly

Jae Kwak, Da Yu, Seungbae Park, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Code acquisition in DS/SS system using periodic property of PN code

Kyung-Woon Jang, Tae-Hoon Kim, Jeong-Hee Choi, 2000, VTC2000-Spring. 2000 IEEE 51st Vehicular Technology Conference Proceedings (Cat. No.00CH37026).

Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications

Kyung-Woon Jang, Kyung-Wook Paik, Chang-Kyu Chung, 2008, Microelectron. Reliab..

Code acquisition system using periodic property of PN code in Rayleigh fading channel

Kyung-Woon Jang, Tae-Hoon Kim, Yong-Wan Park, 2000, Vehicular Technology Conference Fall 2000. IEEE VTS Fall VTC2000. 52nd Vehicular Technology Conference (Cat. No.00CH37152).

Green manufacturing process for solder-less PCB assembly using uniform pressure surface interconnector and anisotropic conductive film

Seungbae Park, Kyung-Woon Jang, Min-Young Park, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

Jin-Hyoung Park, Kyung-Woon Jang, Kyung-Wook Paik, 2012, Microelectron. Reliab..

Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Kyung-Woon Jang, Kyung-Wook Paik, H.-Y Son, 2008, 2008 58th Electronic Components and Technology Conference.

Epoxy/BaTiO3 (SrTiO3) Composite Films and Pastes For High Dielectric Constant and Low Tolerance Embedded Capacitors in Organic Substrates

Kyung-Woon Jang, Kyung-Wook Paik, Sangyong Lee, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

Kyung-Woon Jang, Kyung-Wook Paik, H.-Y Son, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

A study on epoxy/BaTiO/sub 3/ embedded capacitor pastes for organic substrates

Kyung-Woon Jang, Kyung-Wook Paik, 2006, 56th Electronic Components and Technology Conference 2006.

High reliable non-conductive adhesives for flip chip CSP applications

Kyung-Woon Jang, Jin-Sang Hwang, Woon-Seong Kwon, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Reliability Evaluation for Flip-Chip Electronic Packages under High Temperature and Moisture Condition using Moiré

Jin-Hyoung Park, Kyung-Woon Jang, Kyung-Wook Paik, 2008, 2008 10th Electronics Packaging Technology Conference.