Jeffrey C. Suhling

发表

BGA Reliability in Automotive Underhood Applications

Robert Darveaux, Nokibul Islam, Pradeep Lall, 2003 .

Transient-Response Spectral Analysis Based Feature Extraction for Built-In Reliability Test of Electronics Under Shock Loads

Pradeep Lall, Jeffrey C. Suhling, P. Choudhary, 2007 .

Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics

Pradeep Lall, Jeffrey C. Suhling, Aniket Shirgaokar, 2008 .

Reliability of small BGAs in the automotive environment

R. Wayne Johnson, Nokibul Islam, Jeffrey C. Suhling, 2002 .

A Chip-on-Beam Calibration Technique for Piezoresistive Stress Sensor Die

Jeffrey C. Suhling, Richard C. Jaeger, Yonggang Chen, 2003 .

Models for Shock and Vibration Survivability of Electronic and MEMS Packaging

Pradeep Lall, Jeffrey C. Suhling, P. Choudhary, 2005 .

Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon

Chun-Hyung Cho, Jeffrey C. Suhling, Richard C. Jaeger, 2009 .

Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics

Pradeep Lall, Jeffrey C. Suhling, Dinesh Arunachalam, 2011 .

Reliability and life study of hydraulic solenoid valve. Part 2: Experimental study

Song-Yul Choe, George T. Flowers, Jeffrey C. Suhling, 2009 .

Drop Reliability of Corner Bonded CSP in Portable Products

Pradeep Lall, R. Wayne Johnson, Jeffrey C. Suhling, 2003 .

Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact

Pradeep Lall, Jeffrey C. Suhling, Dhananjay Panchagade, 2006 .

Combined Controller for Test System of High Capacity Hydraulic Pump

Jeffrey C. Suhling, Wenjun Meng, 2010 .

Reliability and Life Study of Hydraulic Solenoid Valve - Part 2 - Experimental Study

Song-Yul Choe, Jeffrey C. Suhling, S. V. Angadi, 2009 .

Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging

Pradeep Lall, Jeffrey C. Suhling, P. Choudhary, 2005 .

Errors associated with the design, calibration and application of piezoresistive stress sensors in (100) silicon

Jeffrey C. Suhling, Richard C. Jaeger, R. Ramani, 1994 .

Condition-Based Assessment of Damage Progression During Mechanical Shock in Electronic Assemblies

Pradeep Lall, Jeffrey C. Suhling, P. Choudhary, 2006 .

Drop-Impact Reliability of Chip-Scale Packages in Handheld Products

Pradeep Lall, R. Wayne Johnson, Jeffrey C. Suhling, 2003 .

Methodologies for Prognostication and Health Monitoring of Leaded and Lead Free Electronics and MEMS Packages in Harsh Environments

Nokibul Islam, Pradeep Lall, Jeffrey C. Suhling, 2005 .

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

Pradeep Lall, Vikrant More, Kai Goebel, 2009 .

Risk Management Models for Flip-Chip Electronics in Extreme Environments

Jim Blanche, Pradeep Lall, Ganesh Hariharan, 2006 .

Damage Relationships for BGA Reliability in Harsh Environments

Robert Darveaux, Nokibul Islam, Pradeep Lall, 2003 .

Feature Vector Based Failure Mode Identification and Prognostication of Electronics Subjected to Shock and Vibration

Pradeep Lall, Jeffrey C. Suhling, Prashant Gupta, 2009 .

Reliability Studies for Package-on-Package Components in Drop and Shock Environments

Pradeep Lall, Jeffrey C. Suhling, Arjun Angral, 2011 .

Prognosis Methodologies for Health Management of Electronics and MEMS Packaging

Nokibul Islam, Pradeep Lall, Jeffrey C. Suhling, 2004 .

Time-Frequency Analysis and Built-In Reliability Test for Health Monitoring of Electronics Under Shock Loads

Pradeep Lall, Jeffrey C. Suhling, P. Choudhary, 2007 .

Four-Wire Bridge Measurements of van der Pauw Stress Sensors on (100) and (111) Silicon

Jeffrey C. Suhling, Richard C. Jaeger, Safina Hussain, 2013 .

Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly

Pradeep Lall, Jeffrey C. Suhling, Richard C. Jaeger, 2013 .

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Jeffrey C. Suhling, Wayne Johnson, 2007 .

Methodologies for System-State Interrogation for Prognostication of Electronics Under Thermo-Mechanical Loads

Chandan Bhat, Pradeep Lall, Jeffrey C. Suhling, 2007 .

Prognostication and Health Monitoring of Electronics in Implantable Biological Systems

Pradeep Lall, Jeffrey C. Suhling, Prashant Gupta, 2008 .

Leading Indicators of Damage for Prognostication of Leadfree Electronics Subjected to Multiple Thermo-Mechanical Environments

Pradeep Lall, Vikrant More, Kai Goebel, 2009 .

Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses

Chandan Bhat, Pradeep Lall, Jeffrey C. Suhling, 2007 .

A Study on Vibration-Induced Fretting Degradation in Connector Systems

Chen Chen, Jeffrey C. Suhling, George T. Flowers, 2009 .

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

Pradeep Lall, Jeffrey C. Suhling, Prashant Gupta, 2009 .

Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact

Pradeep Lall, Jeffrey C. Suhling, Wayne Johnson, 2004 .

Impact of Piezoresistive Coefficient Uncertainty on Stress Measurement Using Silicon Multi-Resistor Sensor Rosettes

Chun-Hyung Cho, Jeffrey C. Suhling, Richard C. Jaeger, 2008 .

Accrued Damage and Remaining Life in Field Extracted Assemblies Under Sequential Thermo-Mechanical Loads

Pradeep Lall, Kai Goebel, Jeffrey C. Suhling, 2011 .