Yasuhiro Koshio
发表
Process integration of fine pitch micro-bumping and Cu redistribution wiring for power efficient SiP
Tadashi Iijima,
Takashi Togasaki,
Masahiro Miyata,
2010,
3rd Electronics System Integration Technology Conference ESTC.
Makoto Takahashi,
Manabu Watanabe,
Mototsugu Hamada,
2011,
IEEE Journal of Solid-State Circuits.