A. Klein

发表

Measurement of reaction-in-flight neutrons using thulium activation at the National Ignition Facility

Malcolm M. Fowler, Robert S. Rundberg, Gary P. Grim, 2014, Optics & Photonics - Optical Engineering + Applications.

Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy

F. Reier, A. Klein, A. Klein, 1998 .

Impact of film thickness and temperature on the dielectric breakdown behavior of sputtered aluminum nitride thin films

Ulrich Schmid, Achim Bittner, Michael Schneider, 2015 .

Flip chip mounting of laser diodes with Au/Sn solder bumps: bumping, self-alignment and laser behavior

P. Kurpas, W. Pittroff, J. Wurfl, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.