T. Segerberg

Life cycle assessment of tin-lead solder and silver-epoxy conductive adhesive

T. Segerberg, P. Hedemalm, 1996, Proceedings of the 1996 IEEE International Symposium on Electronics and the Environment. ISEE-1996.

Comparative life cycle assessment (LCA) of modern interconnection techniques for printed board assemblies

T. Segerberg, P. Hedemalm, 1995, Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.