文
论文分享
演练场
杂货铺
论文推荐
字
编辑器下载
登录
注册
Chihyun Park
发表
Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress
Dong Geon Jung, Seong Ho Kong, Jun Eon An, 2019, Sensors.