Jr-Ming Chen

An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem

Shang-Lin Wu, Ching-Te Chuang, Wei Hwang, 2017, IEEE Transactions on Electron Devices.

Integration of neural sensing microsystem with TSV-embedded dissolvable µ-needles array, biocompatible flexible interposer, and neural recording circuits

Shang-Lin Wu, Ching-Te Chuang, Wei Hwang, 2016, 2016 IEEE Symposium on VLSI Technology.