Liang Meng

发表

Packaging technology of LEDs for LCD backlights

Wang Guohong, Fan Manning, Liang Meng, 2009 .

Effects of Surface Treatments on Ohmic Contact to p-GaN

Shi Hongwei, Liu Zhiqiang, Wang Guohong, 2007 .

Behaviors of the interface and matrix for the Ag/Cu bimetallic laminates prepared by roll bonding and diffusion annealing

Liang Meng, Liangchi Zhang, Fan Yang, 2004 .

Deformation twinning behaviors of the low stacking fault energy high-entropy alloy: An in-situ TEM study

Youtong Fang, Gang Wang, Xu Yuqing, 2017 .