Stephen L. Buchwalter

Multilayer printed circuit board structure.

Karl Hermann, Mark Fielding Bregman, Stephen L. Buchwalter, 1990 .

Effects of mechanical stress and moisture on packaging interfaces

Michael A. Gaynes, Kang-Wook Lee, Claudius Feger, 2005, IBM J. Res. Dev..

Cleavable epoxy resins: Design for disassembly of a thermoset

Laura L. Kosbar, Stephen L. Buchwalter, L. Kosbar, 1996 .

Underfill: The Enabling Technology for Flip-Chip Packaging

Michael A. Gaynes, Daniel R. Gamota, Stephen L. Buchwalter, 2001 .

Development of conductive adhesive materials for via fill applications

Sampath Purushothaman, Mark D. Poliks, Jeffrey D. Gelorme, 2001 .

Organic chemistry on a polyimide surface

L. Paivikki Buchwalter, Stephen L. Buchwalter, L. P. Buchwalter, 1992 .