V. Solberg

Reliable and low cost wafer level packaging. Process description and qualification testing results for wide area vertical expansion (WAVE/sup TM/) package technology

J. Fjelstad, V. Solberg, D. Light, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).

CSP package development: the 4.0 manufactur1ng process for /spl mu/BGA(R)

V. Solberg, 1999, Proceedings of the Technical Program. ELECTRO 99 (Cat. No.99CH36350).

Low Cost Chip-Scale BGA Packaging for Portable and Other Miniature Product Applications

V. Solberg, 1997 .

Chip size BGA packaging for high performance memory

V. Solberg, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Performance evaluations of stacked CSP memory modules

V. Solberg, G. Gray, 2004, IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585).

μPILRtrade package-on-package technology: development and reliability testing

V. Solberg, 2007, 2007 9th Electronics Packaging Technology Conference.