Jiangyan Sun

Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps

Ming Li, Qinghua Zhao, Anmin Hu, 2013, Microelectron. Reliab..

Development of Large Die Fine-Pitch Cu/Low- $k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Shiguo Liu, Yue Ying Ong, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

John H. Lau, V. Kripesh, Shiguo Liu, 2009, 2009 59th Electronic Components and Technology Conference.