Chang-Lin Yeh

发表

Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

Yi-Shao Lai, Ching-Chun Wang, Chang-Lin Yeh, 2007 .

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages

Yi-Shao Lai, Tsung-Yueh Tsai, Chang-Lin Yeh, 2008, Microelectron. Reliab..

Transient simulation of wire pull test on Cu/low-K wafers

Yi-Shao Lai, Chin-Li Kao, Chang-Lin Yeh, 2006, IEEE Transactions on Advanced Packaging.

Response spectra analysis for transient structural responses of board-level electronic packages subjected to half-sine impact acceleration pulses

Yi-Shao Lai, Tsung-Yueh Tsai, Chang-Lin Yeh, 2005, 2005 7th Electronic Packaging Technology Conference.

Evaluation of solder joint strengths under ball impact test

Yi-Shao Lai, Chang-Lin Yeh, Hsiao-Chuan Chang, 2007, Microelectron. Reliab..

Transient analysis of the impact stage of wirebonding on Cu/low-K wafers

Yi-Shao Lai, Chang-Lin Yeh, Y. Lai, 2005, Microelectron. Reliab..

Transient analysis of board-level drop response of lead-free chip-scale packages with experimental verifications

Yi-Shao Lai, Chang-Lin Yeh, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

High-G drop impact response and failure analysis of a chip packaged printed circuit board

Yi-Shao Lai, Chang-Lin Yeh, S.T. Jenq, 2005, 2005 7th Electronic Packaging Technology Conference.

High-G drop impact response and failure analysis of a chip packaged printed circuit board

Yi-Shao Lai, Chang-Lin Yeh, S. T. Jenq, 2007 .

Design Guideline for Ball Impact Test Apparatus

Yi-Shao Lai, Chang-Lin Yeh, Y. Lai, 2007 .

Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique

Shen-Li Fu, Chang-Lin Yeh, Hsiang-Chen Hsu, 2006, 2006 International Conference on Electronic Materials and Packaging.

Evaluation ofThermalCharacteristics ofBoard-level HighPerformance Flip-chip Package Equipped withVaporChamberasHeatSpreader

Chang-Chi Lee, Rong-Tai Liu, Chang-Lin Yeh, 2008 .

Finite element model verification for packaged printed circuit board by experimental modal analysis

Yi-Shao Lai, Chang-Lin Yeh, Bor-Tsuen Wang, 2008, Microelectron. Reliab..

Effects of different drop test conditions on board-level reliability of chip-scale packages

Yi-Shao Lai, Chang-Lin Yeh, Po-Chuan Yang, 2008, Microelectron. Reliab..

Development of ball impact test system

Yi-Shao Lai, Chang-Lin Yeh, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Correlation between package-level ball impact test and board-level drop test

Yi-Shao Lai, Chang-Lin Yeh, Hsiao-Chuan Chang, 2005, 2005 7th Electronic Packaging Technology Conference.

High-GDropImpact Response andFailure Analysis ofaChipPackaged Printed Circuit Board

Yi-Shao Lai, Chang-Lin Yeh, Jenq-Dah Wu, 2005 .

Three-dimensional stress analysis of ink marking process [electronic packaging applications]

Yi-Shao Lai, Chang-Lin Yeh, Yi-Hsien Lin, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Spectrum response analysis for PCB with heating ICs in different heating conditions

Yi-Shao Lai, Chang-Lin Yeh, Ying-Chih Lee, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition

Yi-Shao Lai, Tsung-Yueh Tsai, Chang-Lin Yeh, 2007, Microelectron. Reliab..

Evaluation of board-level reliability of electronic packages under consecutive drops

Chin-Li Kao, Chang-Lin Yeh, Yi-Shao Lai, 2006, Microelectron. Reliab..

Calibration of Equivalent Finite Element Model for Packaged Printed Circuit Board by Experimental Modal Analysis

Chang-Lin Yeh, Bor-Tsuen Wang, Rong-Sheng Chen, 2008, 2008 10th Electronics Packaging Technology Conference.

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi-Shao Lai, Chang-Lin Yeh, Ping-Feng Yang, 2006, Microelectron. Reliab..

Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses

Yi-Shao Lai, Tsung-Yueh Tsai, Chang-Lin Yeh, 2007, Microelectron. Reliab..

Characteristic of copper wire and transient analysis on wirebonding process

Yi-Shao Lai, Chang-Lin Yeh, Hsiang-Chen Hsu, 2011, Microelectron. Reliab..

Empirical correlation between package-level ball impact test and board-level drop reliability

Yi-Shao Lai, Chang-Lin Yeh, Hsiao-Chuan Chang, 2007, Microelectron. Reliab..

Design of Drop Test Apparatus for Electronic Packages

Yi-Shao Lai, Chang-Lin Yeh, 2005 .

Optimal design in enhancing board-level thermomechanical and drop reliability of package-on-package stacking assembly

Yi-Shao Lai, Ching-Chun Wang, Chang-Lin Yeh, 2005, 2005 7th Electronic Packaging Technology Conference.

Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops

Yi-Shao Lai, Chang-Lin Yeh, 2008, Microelectron. Reliab..

Support excitation scheme for transient analysis of JEDEC board-level drop test

Yi-Shao Lai, Chang-Lin Yeh, Y. Lai, 2006, Microelectron. Reliab..

Incorporating Response Spectra and Modal Superposition in Analyzing Transient Responses of Structural Systems Subjected to Half-Sine Impact Acceleration Pulses

Yi-Shao Lai, Tsung-Yueh Tsai, Chang-Lin Yeh, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Transient fracturing of solder joints subjected to displacement-controlled impact loads

Yi-Shao Lai, Chang-Lin Yeh, 2006, Microelectron. Reliab..

A study of crack propagation in Pb-free solder joints under drop impact

Yi-Shao Lai, E.H. Wong, W.D. van Driel, 2008, 2008 58th Electronic Components and Technology Conference.

Application of submodeling technique to transient drop impact analysis of board-level stacked die packages

Yi-Shao Lai, Chang-Lin Yeh, Hsiang-Chen Hsu, 2006, 2006 8th Electronics Packaging Technology Conference.

Strain-rate and impact velocity effects on joint adhesion strength

Yi-Shao Lai, Chang-Lin Yeh, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process

Yi-Shao Lai, Shen-Li Fu, Chang-Lin Yeh, 2007, 2007 International Conference on Electronic Materials and Packaging.

Comprehensive dynamic analysis of wirebonding on Cu/low-K wafers

Yi-Shao Lai, Chang-Lin Yeh, Y. Lai, 2006 .

Dynamic analysis of wirebonding process on Cu/low-K wafers

Yi-Shao Lai, Chang-Lin Yeh, Jenq-Dah Wu, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Characterizations of ball impact responses of wafer-level chip-scale packages

Yi-Shao Lai, Chin-Li Kao, Chang-Lin Yeh, 2008 .

Prediction ofBoard-level Reliability ofChip-scale Packages UnderConsecutive Drops

Yi-Shao Lai, Chin-Li Kao, Chang-Lin Yeh, 2005 .

Transient Submodeling Analysis for Board-Level Drop Tests of Electronic Packages

Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen, 2007, IEEE Transactions on Electronics Packaging Manufacturing.

Insights into correlation between board-level drop reliability and package-level ball impact test

Yi-Shao Lai, Chang-Lin Yeh, Y. Lai, 2006, 56th Electronic Components and Technology Conference 2006.

Transient analysis of impact fracturing of solder joints

Yi-Shao Lai, Chang-Lin Yeh, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Prediction of board-level reliability of chip-scale packages under consecutive drops

Yi-Shao Lai, Chin-Li Kao, Chang-Lin Yeh, 2005, 2005 7th Electronic Packaging Technology Conference.

Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test

Yi-Shao Lai, Chang-Lin Yeh, 2006 .

Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model

Yi-Shao Lai, Shen-Li Fu, Chang-Lin Yeh, 2008, 2008 10th Electronics Packaging Technology Conference.

Parametric study on board-level electronic test device subjected to JEDEC vibration loads

Yi-Shao Lai, Ching-Chun Wang, Chang-Lin Yeh, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Examination of board-level drop reliability of package-on-package stacking assemblies of different structural configurations

Yi-Shao Lai, Ching-Chun Wang, Chang-Lin Yeh, 2007 .