I. Shubin

发表

A complete 10 Gbps chip-to-chip digital CMOS silicon photonic link

Xuezhe Zheng, Ying Luo, J. Lexau, 2012, 2012 Conference on Lasers and Electro-Optics (CLEO).

Alignment and integration of a hybrid, external-cavity InP-SOI laser

I. Shubin, J. E. Cunningham, A. V. Krishnamoorthy, 2016, 2016 Optical Fiber Communications Conference and Exhibition (OFC).

A novel MCM package enabling proximity communication I-O

H. Thacker, I. Shubin, J. E. Cunningham, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

“Dual-purpose” remateable Conductive Ball-in-Pit interconnects for chip powering and passive alignment in Proximity Communication enabled multi-chip packages

Ying Luo, I. Shubin, J. E. Cunningham, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects

I. Shubin, J. E. Cunningham, A. V. Krishnamoorthy, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Characterization of an electroabsorption modulator design with high-dynamic range for broadband analog applications

I. Shubin, Henry Zmuda, Rebecca J. Bussjager, 2008, SPIE Defense + Commercial Sensing.

A 33mW 100Gbps CMOS silicon photonic WDM transmitter using off-chip laser sources

Xuezhe Zheng, Ying Luo, J. Lexau, 2013, 2013 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC).

Silicon Photonic Interconnects for Large-Scale Computer Systems

Xuezhe Zheng, J. Lexau, Guoliang Li, 2013, IEEE Micro.

Microspring Characterization and Flip-Chip Assembly Reliability

Ying Luo, I. Shubin, J. E. Cunningham, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Microwave photonics links in modem networks: Component technology

I. Shubin, P.K.L. Yu, G. Li, 2004, 2004 24th International Conference on Microelectronics (IEEE Cat. No.04TH8716).

Assembly and alignment of Proximity Communication enabled multi-chip packages using elastomeric bump interposers

I. Shubin, J. E. Cunningham, J. G. Mitchell, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Optical Proximity Communication in packaged SiPhotonics

Xuezhe Zheng, J. Lexau, I. Shubin, 2008, 2008 5th IEEE International Conference on Group IV Photonics.

40 Gb/s thermally tunable CMOS ring modulator

Xuezhe Zheng, Ying Luo, H. Thacker, 2012, The 9th International Conference on Group IV Photonics (GFP).

Wide bandwidth, low loss 1 by 4 wavelength division multiplexer on silicon for optical interconnects

I. Shubin, A. Mizrahi, Y. Fainman, 2011, 2011 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference.

A package demonstration with solder free compliant flexible interconnects

I. Shubin, E. M. Chow, N. Nettleton, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Optical interlayer coupling design for optical interconnects based on mirror enhanced grating couplers

Xuezhe Zheng, Ying Luo, H. Thacker, 2012, 2012 Optical Interconnects Conference.

Gain Limit in Analog Links Using Electroabsorption Modulators

I. Shubin, P.K.L. Yu, X.B. Xie, 2006, IEEE Photonics Technology Letters.

Compacting High-End Computing Systems with Dense, WDM Silicon Photonic Interconnects

J. Lexau, F. Liu, H. Thacker, 2010, 2010 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

High Power MQW Electroabsorption Modulator with a Waveguide Taper

I. Shubin, P.K.L. Yu, X.B. Xie, 2007, Microwave Photonics, 2007 Interntional Topical Meeting on.

High-power intrastep quantum well electroabsorption modulator using single-sided large optical cavity waveguide

I. Shubin, P.K.L. Yu, W.S.C. Chang, 2004, IEEE Photonics Technology Letters.