Peter Krueger

Green fluorescent nanodiamond conjugates and their possible applications for biosensing

Juergen Schreiber, Wolfgang Pompe, Joerg Opitz, 2010, NanoScience + Engineering.

3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy

Andrew C. Rudack, Alain C. Diebold, Ehrenfried Zschech, 2012 .

NanoXCT—A High‐Resolution Technique For TSV Characterization

Ehrenfried Zschech, Sven Niese, Peter Krueger, 2011 .