Herbert Struyf

发表

Lithography aspects of dual-damascene interconnect technology

Kurt G. Ronse, Mireille Maenhoudt, Diziana Van Goidsenhoven, 2001, Microelectronic and MEMS Technologies.

Optimizing high frequency ultrasound cleaning in the semiconductor industry

Stefan De Gendt, Marc Hauptmann, Herbert Struyf, 2012, CAV 2012.

30nm half-pitch metal patterning using Moti CD shrink technique and double patterning

Vincent Wiaux, Mireille Maenhoudt, Johan Vertommen, 2008, SPIE Advanced Lithography.

Influence of environments on the footprint of particle contamination on EUV mask

Herbert Struyf, Marc Heyns, Stefan De Gendt, 2011, Advanced Lithography.

Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications using RELACS shrink and corresponding OPC

Vincent Wiaux, Ivan Ciofi, Herbert Struyf, 2007, SPIE Advanced Lithography.

Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias

Tetsu Tanaka, Fumihiro Inoue, Herbert Struyf, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora\textregistered LK HM

David De Roest, Nancy Heylen, Herbert Struyf, 2010 .

Height Uniformity of Micro-Bumps Electroplated on Thin Cu Seed Layers

Philippe M. Vereecken, John Slabbekoorn, Herbert Struyf, 2016 .

S-passivation of the Ge gate stack: Tuning the gate stack properties by changing the atomic layer deposition oxidant precursor

Laura Nyns, Herbert Struyf, Guy Brammertz, 2011 .

Integration of 50nm half pitch single damascene copper trenches in Black Diamond (R) II by means of double patterning 193nm immersion lithography on metal hardmask

Ivan Ciofi, Herbert Struyf, Gerald Beyer, 2008 .

W2W permanent stacking for 3D system integration

Eric Beyne, Andy Miller, Herbert Struyf, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Nucleation Kinetics of Electroless Cu Deposition on Ruthenium Using Glyoxylic Acid as a Reducing Agent

Herbert Struyf, Fumihiro Inoue, Stefaan Van Huylenbroeck, 2014 .

3D-SoC integration utilizing high accuracy wafer level bonding

Eric Beyne, Andy Miller, Nancy Heylen, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Influence of low-k dry etch chemistries on the properties of copper and a Ta-based diffusion barrier

Karen Maex, Herbert Struyf, Francesca Iacopi, 2003 .

Defect detection in Through Silicon Vias by GHz Scanning Acoustic Microscopy: Key ultrasonic characteristics

Eric Beyne, Ingrid De Wolf, Herbert Struyf, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Evaluation and interpretation of bubble size distributions in pulsed megasonic fields

Christ Glorieux, Herbert Struyf, S. De Gendt, 2013 .

Processing damage and electrical performance of porous dielectrics in narrow spaced interconnects

Karen Maex, Herbert Struyf, Michele Stucchi, 2004 .

Si cap passivation for Ge nMOS applications

Aaron Thean, Nadine Collaert, Laura Nyns, 2013 .

Role of Bath Composition in Electroless Cu Seeding on Co Liner for through-Si Vias

Herbert Struyf, Fumihiro Inoue, Stefaan Van Huylenbroeck, 2015 .