Rihui He

Storage capacitor for electromechanical systems

Jae Hyeong Seo, Ming-Hau Tung, Marc Maurice Mignard, 2012 .

Alow Temperature Vacuum Package Utilizing Porous Alumina Thin Film Encapsulation

Chang-Jin Kim, Rihui He, 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems.

Low-Temperature Monolithic Encapsulation Using Porous-Alumina Shell Anodized on Chip

Chang-Jin Kim, Rihui He, 2009, Journal of Microelectromechanical Systems.

On-Wafer Monolithic Encapsulation by Surface Micromachining With Porous Polysilicon Shell

Chang-Jin Kim, Rihui He, 2007, Journal of Microelectromechanical Systems.