A. Otto

DoE simulations and measurements with the microDAC stress chip for material and package investigations

B. Wunderle, S. Rzepka, B. Michel, 2011, 18th European Microelectronics & Packaging Conference.

Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments

T. Gessner, H. Vogt, F. Naumann, 2016, 2016 China Semiconductor Technology International Conference (CSTIC).

TAPE LAPPING LINE FOR FLEXIBLE HIGH-FREQUENCY COAX CABLES

A. Otto, P.-A. Schneider, 1997 .

Stress chip measurements of the internal package stress for process characterization and health monitoring

B. Wunderle, S. Rzepka, B. Michel, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Reliability investigation and design of high power rectifier modules based on material characterization, simulation and experimental verification

S. Rzepka, P. Lurkens, E. Merten, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.