Ravi Kandasamy

Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages

Ravi Kandasamy, Suresh Subramanyam, R. Kandasamy, 2005 .

Thermal analysis of a flip chip ceramic ball grid array (CBGA) package

Ravi Kandasamy, A. S. Mujumdar, A. Mujumdar, 2008, Microelectron. Reliab..

Interface thermal characteristics of flip chip packages : A numerical study

Arun S. Mujumdar, Ravi Kandasamy, A. Mujumdar, 2009 .