Eduardo Monlevade

Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu

Weiqun Peng, Eduardo Monlevade, Marco E. Marques, 2007, Microelectron. Reliab..

Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects

Eduardo Monlevade, W. Peng, Weiqun Peng, 2007 .