Wan Ho Song

Packaging test chip for flip-chip and wire bonding process characterization

J. Schwizer, Wan Ho Song, M. Mayer, 2003, TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).

More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode

Wan Ho Song, Nhat Ly, Di Erick Xu, 2015, Microelectron. Reliab..

Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls

Yan Huang, Wan Ho Song, Jae Pil Jung, 2009 .

Cantilever-based biosensors in CMOS technology

Yue Li, Martin Zimmermann, Andreas Hierlemann, 2005, Design, Automation and Test in Europe.

Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding

Y. Zhou, Michael Mayer, J. S. Hwang, 2012, Microelectron. Reliab..