Chang-Ming Liu

Reliability analysis and design for the fine-pitch flip chip BGA packaging

Chih-Tang Peng, Ji-Cheng Lin, Kuo-Ning Chiang, 2004 .

Enhancing the Reliability of Wafer Level Packaging by Using Solder Joints Layout Design

Chang-Chun Lee, Chang-Ming Liu, Kuo-Ning Chiang, 2006, IEEE Transactions on Components and Packaging Technologies.

Solder reflow prediction of hybrid pad packaging system

Kuo-Ning Chiang, Chang-Ming Liu, 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

Multimedia thermal CAD system for electronics multilayer structures with compact cold plate

Chang-Ming Liu, L. K. Liu, Y. H. Hung, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Corrections to "Enhancing the reliability of wafer level packaging by using solder joints layout design"

Chang-Chun Lee, Kuo-Ning Chiang, Chang-Ming Liu, 2007 .

Contrasting Changes in Vegetation Growth due to Different Climate Forcings over the Last Three Decades in the Selenga-Baikal Basin

Ning Ma, Ping Wang, Chang-Ming Liu, 2019, Remote. Sens..