M. P. Y. Desmulliez

Design and construction of a 2-D parallel opto-electronic sorter demonstrator based on CMOS/InGaAs smart pixel technology

John Fraser Snowdon, M. H. Dunn, Brian S. Wherrett, 1995 .

On variable frequency microwave processing of heterogeneous chip-on-board assemblies

T. Tilford, C. Bailey, M. P. Y. Desmulliez, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Hybrid Additive Manufacture of Conformal Antennas

I. D. Robertson, J. Marques-Hueso, M. P. Y. Desmulliez, 2018, 2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP).

Piezoresistive membrane deflection test structure for the evaluation of hermeticity in low cavity volume MEMS and microelectronic packages

A. J. Walton, S. Cargill, S. Costello, 2012, 2012 IEEE International Conference on Microelectronic Test Structures.

Encapsulation of Microelectronic Components Using Open-Ended Microwave Oven

G. Goussetis, S. K. Pavuluri, M. Ferenets, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Assessment of the ultrasonic properties of additive manufactured materials for passive components of piezoelectric transducers

S. Cochran, V. Seetohul, G. Cummins, 2016, 2016 IEEE International Ultrasonics Symposium (IUS).